Muhammad Rahman

Search results

• 2017

  Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging

  Pok, Y. W., Sujan, D., Rahman, M. E. & Dol, S. S., May 2017, 3rd International Conference on Mechatronics and Mechanical Engineering (ICMME 2016): MATEC Web of Conferences Volume 95 (2017). Yuan, H. L., Agarwal, R. K., Tandon, P. & Wang, E. X. (eds.). Paris: EDP Sciences, Vol. 95. p. 9-14 6 p. 01003. (MATEC Web of Conferences).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  Open Access

  File

  • Young's Modulus 100%
  • Material 50%
  • Thermal Stress 50%
  • Thermal Expansion 50%
  • Poisson Ratio 50%
  1 Citation (Scopus)

  16 Downloads (Pure)
• 2011

  Bi-layered model of interfacial thermal stresses with the effect of different temperatures in the layers

  Debnath, S., Rahman, M. E., Engida, W. D., Murthy, M. V. V. & Seetharamu, K. N., 2011, Applied Mechanics and Manufacturing Technology, AMMT'11. p. 63-70 8 p. (Applied Mechanics and Materials; vol. 87).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
  2 Citations (Scopus)
• 2006

  A parametric study of backfilled trench for reduction of tbm induced ground vibrations

  Rahman, M. E. & Orr, T. L. L., 2006, 13th International Congress on Sound and Vibration 2006, ICSV 2006. p. 1296-1303 8 p. (13th International Congress on Sound and Vibration 2006, ICSV 2006; vol. 2).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review