TY - JOUR
T1 - A Lightweight Wireless Overpressure Node Based Efficient Monitoring for Shock Waves
AU - Gao, Shang
AU - Tian, Guiyun
AU - Dai, Xuewu
AU - Zhang, Qing
AU - Wang, Zhiling
AU - Yang, Xinge
AU - Wang, Qiaomu
AU - Jia, Naishu
N1 - Funding Information:
Manuscript received January 9, 2019; revised May 5, 2019, March 16, 2020, and August 11, 2020; accepted September 18, 2020. Date of publication September 25, 2020; date of current version February 16, 2021. Recommended by Technical Editor X.-T. Yan and Senior Editor I.-M. Chen. This work was supported in part by the Nanjing University of Science and Technology under Research Start-Up Funds under Grant AE89991/032; in part by the Fundamental Research Funds for the Central Universities under Grant 309181A8804 and Grant 30919011263, in part by the Natural Science Foundation of Jiangsu Province, China under Grant BK20190464, in part by the Jiangsu Planned Projects for Postdoctoral Research Funds under Grant 1003-YBA20012, in part by the Chinese Postdoctoral Science Foundation under Grant 2020M671481, and in part by the National Natural Science Foundation of China under Grant 61527803, Grant 51905242, Grant 61960206010, and Grant 61903193. (Corresponding author: Shang Gao.) Shang Gao and Qing Zhang are with the College of automation engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China (e-mail: [email protected]; [email protected]).
PY - 2021/2
Y1 - 2021/2
N2 - Overpressure measurement is an important approach to evaluate the power of shock wave (SW) monitoring. Traditional wired monitoring systems exhibit the limitations of high-cost, heavyweight, troublesome maintenance, and big-data transmission in SW monitoring. In this article, a new lightweight FPGA-based wireless overpressure node (LFWON) with the resistance to higherature and high-pressure environment for SW monitoring. The proposed LFWON is based on the Spartan-6 XC6SLX9-2TQG144C FPGA circuit, via a serial peripheral interface to the RF transceiver and data bus to the NAND flash chip for data management. To validate the LFWON, experimental tests in terms of dynamic parameters and network quality are performed in a real blast testing with 8-kg trinitrotoluene. This article is conducted to provide new insights into how the antishocking structure and sensing algorithm of wireless sensor node is designed in SW monitoring for acquiring overpressure accurately. The results show that the errors of Δ P(7 m-12m), td(>6 m), and I + (3m-24 m) from proposed LFWON are below 20% in comparison with wired system. In addition, the RSSI value of LFWON should be set above-70 dBm for stable communication quality.
AB - Overpressure measurement is an important approach to evaluate the power of shock wave (SW) monitoring. Traditional wired monitoring systems exhibit the limitations of high-cost, heavyweight, troublesome maintenance, and big-data transmission in SW monitoring. In this article, a new lightweight FPGA-based wireless overpressure node (LFWON) with the resistance to higherature and high-pressure environment for SW monitoring. The proposed LFWON is based on the Spartan-6 XC6SLX9-2TQG144C FPGA circuit, via a serial peripheral interface to the RF transceiver and data bus to the NAND flash chip for data management. To validate the LFWON, experimental tests in terms of dynamic parameters and network quality are performed in a real blast testing with 8-kg trinitrotoluene. This article is conducted to provide new insights into how the antishocking structure and sensing algorithm of wireless sensor node is designed in SW monitoring for acquiring overpressure accurately. The results show that the errors of Δ P(7 m-12m), td(>6 m), and I + (3m-24 m) from proposed LFWON are below 20% in comparison with wired system. In addition, the RSSI value of LFWON should be set above-70 dBm for stable communication quality.
KW - Dynamic parameter
KW - network quality
KW - overpressure
KW - shock wave (SW) monitoring
KW - wireless sensor network (WSN)
UR - http://www.scopus.com/inward/record.url?scp=85101240071&partnerID=8YFLogxK
U2 - 10.1109/TMECH.2020.3025955
DO - 10.1109/TMECH.2020.3025955
M3 - Article
AN - SCOPUS:85101240071
SN - 1083-4435
VL - 26
SP - 448
EP - 457
JO - IEEE/ASME Transactions on Mechatronics
JF - IEEE/ASME Transactions on Mechatronics
IS - 1
M1 - 9206070
ER -