Advanced Micromorphology Analysis of Cu/Fe NPs Thin Films

S. Tǎlu*, A. Ghaderi, K. Stȩpień, F. M. Mwema

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

8 Citations (Scopus)


In this work, an advanced analysis of Cu/Fe NPs thin films using atomic force microscopy (AFM) has been discussed to characterize at nanoscale 3-D surface microtexture. Samples of Cu/Fe thin films were fabricated by Direct Current-Magnetron Sputtering technique with two controlled thicknesses (group I: Cu 55 nm/Fe 55 nm and group II: Cu 55 nm/Fe 70 nm) in specific conditions of pressure and power. The results obtained from experimental measurements suggested that the surface of group I has the lowest values for fractal dimension (D = 2.28 ± 0.01) and root mean square height (Sq = 4.40 ± 0.1 nm); while the highest values for fractal dimension (D = 2.31 ± 0.01) and root mean square height (Sq = 4.67 ± 0.1 nm) were found in group II. Stereometric and fractal analyses applied for thin films are modern tools for accurate quantitative morphometric characterisation.

Original languageEnglish
Article number012016
JournalIOP Conference Series: Materials Science and Engineering
Issue number1
Publication statusPublished - 24 Oct 2019
Externally publishedYes
Event2019 International Conference on Advanced Material Research and Processing Technology, AMRPT 2019 - Wuhan, China
Duration: 19 Jul 201921 Jul 2019

Cite this