TY - JOUR
T1 - Advances in piezoelectric thin films for acoustic biosensors, acoustofluidics and lab-on-chip applications
AU - Fu, Y. Q.
AU - Luo, J. K.
AU - Nguyen, N. T.
AU - Walton, A. J.
AU - Flewitt, A. J.
AU - Zu, Xiao-Tao
AU - Li, Y.
AU - McHale, Glen
AU - Matthews, A.
AU - Iborra, Enrique
AU - Du, Hejun
AU - Milne, W. I.
PY - 2017/8/1
Y1 - 2017/8/1
N2 - Recently, piezoelectric thin films including zinc oxide (ZnO) and aluminium nitride (AlN) have found a broad range of lab-on-chip applications such as biosensing, particle/cell concentrating, sorting/patterning, pumping, mixing, nebulisation and jetting. Integrated acoustic wave sensing/microfluidic devices have been fabricated by depositing these piezoelectric films onto a number of substrates such as silicon, ceramics, diamond, quartz, glass, and more recently also polymer, metallic foils and bendable glass/silicon for making flexible devices. Such thin film acoustic wave devices have great potential for implementing integrated, disposable, or bendable/flexible lab-on-a-chip devices into various sensing and actuating applications. This paper discusses the recent development in engineering high performance piezoelectric thin films, and highlights the critical issues such as film deposition, MEMS processing techniques, control of deposition/processing parametres, film texture, doping, dispersion effects, film stress, multilayer design, electrode materials/designs and substrate selections. Finally, advances in using thin film devices for lab-on-chip applications are summarised and future development trends are identified.
AB - Recently, piezoelectric thin films including zinc oxide (ZnO) and aluminium nitride (AlN) have found a broad range of lab-on-chip applications such as biosensing, particle/cell concentrating, sorting/patterning, pumping, mixing, nebulisation and jetting. Integrated acoustic wave sensing/microfluidic devices have been fabricated by depositing these piezoelectric films onto a number of substrates such as silicon, ceramics, diamond, quartz, glass, and more recently also polymer, metallic foils and bendable glass/silicon for making flexible devices. Such thin film acoustic wave devices have great potential for implementing integrated, disposable, or bendable/flexible lab-on-a-chip devices into various sensing and actuating applications. This paper discusses the recent development in engineering high performance piezoelectric thin films, and highlights the critical issues such as film deposition, MEMS processing techniques, control of deposition/processing parametres, film texture, doping, dispersion effects, film stress, multilayer design, electrode materials/designs and substrate selections. Finally, advances in using thin film devices for lab-on-chip applications are summarised and future development trends are identified.
KW - Acoustic wave
KW - Acoustofluidics
KW - AlN
KW - Biosensor
KW - Lab-on-chip
KW - Microfluidics
KW - Piezoelectric
KW - Thin film
KW - ZnO
U2 - 10.1016/j.pmatsci.2017.04.006
DO - 10.1016/j.pmatsci.2017.04.006
M3 - Review article
AN - SCOPUS:85019446727
SN - 0079-6425
VL - 89
SP - 31
EP - 91
JO - Progress in Materials Science
JF - Progress in Materials Science
ER -