TY - GEN
T1 - Bi-layered model of interfacial thermal stresses with the effect of different temperatures in the layers
AU - Debnath, Sujan
AU - Rahman, Muhammad Ekhlasur
AU - Engida, Woldemichael Dereje
AU - Murthy, M. V.V.
AU - Seetharamu, K. N.
PY - 2011
Y1 - 2011
N2 - An interfacial shearing and peeling stress model is proposed to account for different uniform temperatures and thickness wise linear temperature gradients in the layers. This upgraded model can be viewed as a more generic form to determine interfacial stresses under different temperature conditions in a bi-layered assembly. The selected shearing and peeling stress results are presented for the case of die and die attach as commonly seen in electronic packaging. The obtained results can be useful in interfacial stress evaluations and physical design of bi-material assemblies, which are used in microelectronics and photonic applications.
AB - An interfacial shearing and peeling stress model is proposed to account for different uniform temperatures and thickness wise linear temperature gradients in the layers. This upgraded model can be viewed as a more generic form to determine interfacial stresses under different temperature conditions in a bi-layered assembly. The selected shearing and peeling stress results are presented for the case of die and die attach as commonly seen in electronic packaging. The obtained results can be useful in interfacial stress evaluations and physical design of bi-material assemblies, which are used in microelectronics and photonic applications.
KW - Different uniform temperature model
KW - Linear temperature gradient model
KW - Peeling stress
KW - Shearing stress
UR - http://www.scopus.com/inward/record.url?scp=80052918450&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMM.87.63
DO - 10.4028/www.scientific.net/AMM.87.63
M3 - Conference contribution
AN - SCOPUS:80052918450
SN - 9783037852309
T3 - Applied Mechanics and Materials
SP - 63
EP - 70
BT - Applied Mechanics and Manufacturing Technology, AMMT'11
T2 - 2011 International Conference on Applied Mechanics and Manufacturing Technology, AMMT'11
Y2 - 4 August 2011 through 7 August 2011
ER -