Bi-layered model of interfacial thermal stresses with the effect of different temperatures in the layers

Sujan Debnath*, Muhammad Ekhlasur Rahman, Woldemichael Dereje Engida, M. V.V. Murthy, K. N. Seetharamu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

An interfacial shearing and peeling stress model is proposed to account for different uniform temperatures and thickness wise linear temperature gradients in the layers. This upgraded model can be viewed as a more generic form to determine interfacial stresses under different temperature conditions in a bi-layered assembly. The selected shearing and peeling stress results are presented for the case of die and die attach as commonly seen in electronic packaging. The obtained results can be useful in interfacial stress evaluations and physical design of bi-material assemblies, which are used in microelectronics and photonic applications.

Original languageEnglish
Title of host publicationApplied Mechanics and Manufacturing Technology, AMMT'11
Pages63-70
Number of pages8
DOIs
Publication statusPublished - 2011
Externally publishedYes
Event2011 International Conference on Applied Mechanics and Manufacturing Technology, AMMT'11 - Bali, Indonesia
Duration: 4 Aug 20117 Aug 2011

Publication series

NameApplied Mechanics and Materials
Volume87
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Conference

Conference2011 International Conference on Applied Mechanics and Manufacturing Technology, AMMT'11
Country/TerritoryIndonesia
CityBali
Period4/08/117/08/11

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