Abstract
This article details and compares the technology options for post-processing foundry produced CMOS at chip-scale to enable More than Moore functionality. In many cases there are attractions in using chip-based processing through the Multi-Project Wafer route that is frequently employed in research, early-stage development and low-volume production. This article identifies that spray-based photoresist deposition combined with optical maskless lithography demonstrates sufficient performance combined with low cost and operational convenience to offer an attractive alternative to conventional optical lithography, where spin-coated photoresist is exposed through a patterned photomask. [2020-0249]
| Original language | English |
|---|---|
| Pages (from-to) | 1245-1252 |
| Number of pages | 8 |
| Journal | Journal of Microelectromechanical Systems |
| Volume | 29 |
| Issue number | 5 |
| Early online date | 21 Aug 2020 |
| DOIs | |
| Publication status | Published - Oct 2020 |
Keywords
- CMOS
- spray-coating
- maskless
- spin-coating
- More than Moore
- on-chip
- post-processing
- photomask
- optical lithography