Condition monitoring of press-pack IGBT devices using Deformation Detection Approach

Press pack Insulated Gate Bipolar Transistors (PP IGBT) are gaining more attention in HVDC power transmission systems due to their high-power density and high reliability compared with conventional power modules. Condition monitoring of PP IGBTs is normally conducted by estimating the chip temperature which is challenging to implement in practice. This paper presents a new parameter, deformation of the upper lid groove, to indicate the health condition of the PP IGBT based on its unique packaging technique. The thermal-mechanical coupled model is built by FE software in order to investigate the relationship between the deformation and junction temperature of the chips. In addition, the several feasible detection methods of deformation have been discussed and utilization of the fiber Bragg grating (FBG) sensor shows the advantages as the most appropriate approach, which can be further developed for condition monitoring using deformation measurements.