Condition monitoring of press-pack IGBT devices using Deformation Detection Approach

Bowen Gu*, Haimeng Wu, Volker Pickert, Siyang Dai, Zhiqiang Wang, Guofeng Li, Shuai Ding, Bing Ji

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

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Abstract

Press pack Insulated Gate Bipolar Transistors (PP IGBT) are gaining more attention in HVDC power transmission systems due to their high-power density and high reliability compared with conventional power modules. Condition monitoring of PP IGBTs is normally conducted by estimating the chip temperature which is challenging to implement in practice. This paper presents a new parameter, deformation of the upper lid groove, to indicate the health condition of the PP IGBT based on its unique packaging technique. The thermal-mechanical coupled model is built by FE software in order to investigate the relationship between the deformation and junction temperature of the chips. In addition, the several feasible detection methods of deformation have been discussed and utilization of the fiber Bragg grating (FBG) sensor shows the advantages as the most appropriate approach, which can be further developed for condition monitoring using deformation measurements.
Original languageEnglish
Title of host publicationThe 10th International Conference on Power Electronics, Machines and Drives (PEMD 2020)
Place of PublicationStevenage
PublisherIET
Pages355-360
Number of pages6
ISBN (Print)9781839535420
DOIs
Publication statusPublished - 2021
EventPEMD 2020 - The 10th International Conference on Power Electronics, Machines and Drives - Norttingham, Norttingham, United Kingdom
Duration: 15 Dec 202017 Dec 2020
https://pemd.theiet.org/

Conference

ConferencePEMD 2020 - The 10th International Conference on Power Electronics, Machines and Drives
Abbreviated titlePEMD 2020
CountryUnited Kingdom
CityNorttingham
Period15/12/2017/12/20
Internet address

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