Deep reactive ion etching as a tool for nanostructure fabrication

Yong Qing Fu, Alan Colli, Andrea Fasoli, Jikui Luo, Andrew Flewitt, Andrea Ferrari, William Milne

Research output: Contribution to journalArticlepeer-review

91 Citations (Scopus)

Abstract

Deep reactive ion etching (DRIE) is investigated as a tool for the realization of nanostructures and architectures, including nanopillars,siliconnanowires or carbon nanotubes on Si nanopillars, nanowalls, and nanonetworks. The potential of combining top-down fabrication methods with the bottom-up synthesis of one-dimensional nanocomponents is assessed. The field-emission properties of carbon nanotubes/Si pillars hybrid structures are measured, as well as the transport properties of large-area nanowires obtained via nanowire lithography. The potential of DRIE for the fabrication of three-dimensional nanostructures is also revealed.
Original languageEnglish
Pages (from-to)1520
JournalJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
Volume27
Issue number3
DOIs
Publication statusPublished - 2009

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