Deformation analysis of Press-pack IGBT using thermal mechanical coupling method

Bowen Gu*, Haimeng Wu, Volker Pickert, Bing Ji, Siyang Dai, Zhiqiang Wang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

19 Downloads (Pure)

Abstract

Press-pack Insulated Gate Bipolar Transistors (PP IGBT) are becoming increasingly used in HVDC and FACT applications. Due to its unique packaging, its reliability issues have also attracted increasing attention in the engineering field. More comprehensive investigation into the thermal, electrical and mechanical factors should be conducted to reveal the operation condition and status of the devices. The objective of this work is to study the relationship among the deformation of the collector groove and the thermal stress of the chip as well as the contact pressure by simulating the PP IGBT under normal and abnormal conditions. A sophisticated 3D finite element (FE) model of a PP IGBT has been developed which includes the coupling with thermal–mechanical effect. Also, the influence of different pressure and thermal stress on deformation is discussed thoroughly that can provide insight of how to monitor the status of a PP IGBT from the perspective of deformation.
Original languageEnglish
Title of host publicationConference Proceedings of 2021 International Joint Conference on Energy, Electrical and Power Engineering
Subtitle of host publicationPower Electronics, Energy Storage and System Control in Energy and Electrical Power Systems
EditorsCungang Hu, Wenping Cao, Pinjia Zhang, Zhenbin Zhang, Xi Tang
Place of PublicationSingapore
PublisherSpringer
Chapter3
Pages23-33
Number of pages11
Volume899
ISBN (Electronic)9789811919220
ISBN (Print)9789811919213
DOIs
Publication statusPublished - 2022
Event2021 International Joint Conference on Energy, Electrical and Power Engineering - Huanshan, China
Duration: 5 Nov 20217 Nov 2021

Publication series

NameLecture Notes in Electrical Engineering
PublisherSpringer
Volume899
ISSN (Print)1876-1100
ISSN (Electronic)1876-1119

Conference

Conference2021 International Joint Conference on Energy, Electrical and Power Engineering
Abbreviated titleCoEEPE 2021
Country/TerritoryChina
CityHuanshan
Period5/11/217/11/21

Fingerprint

Dive into the research topics of 'Deformation analysis of Press-pack IGBT using thermal mechanical coupling method'. Together they form a unique fingerprint.

Cite this