Abstract
The challenge of utilizing industrial and bio-waste is a global concern. In this paper, Uncarbonized Egg Shell (UES) is employed as a reinforcement to aluminium dross, cement, silicate, and pulverized carbon graphite by mould process. The percentage variation and effects on the thermal and microstructure of building ceiling composite were studied. Compressive strength, water porosity, thermal parameters, and microstructure were determined. Scanning Electron Microscope (SEM) equipped with an energy dispersive spectrometer (EDS) was employed to obtain the microstructural characteristics of the developed materials. The result showed low thermal conductivity in all the three developed: 0.0106 Wm−1 K−1 for 0.3Aldr0.25Cmt0.3Si0.05G0.1UES; 0.0673 Wm−1 K−1 for 0.3Aldr0.23Cmt0.3Si0.05G0.12UES; and 0.0182 Wm−1 K−1 for 0.3Aldr0.2Cmt0.3Si0.05G0.15UES. The least thermal conductivity occurred with sample 0.3Aldr0.25Cmt0.3Si0.05G0.1UES. The highest crushing force and compressive strength are seen in sample 2 with the values of 6.4 KN and 3.3 MN/m2 while the lowest is seen in sample 1 with the values of 4.8 kN and 2.4 MN/m2. The SEM image showed good bonding to start-up materials. Silicone and aluminium are significantly obvious, providing the bond among the building ceiling materials. A moderate eggshell admixture will suffice for good thermal and improved mechanical properties.
Original language | English |
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Pages (from-to) | 1979-1991 |
Number of pages | 13 |
Journal | Silicon |
Volume | 13 |
Issue number | 6 |
Early online date | 15 Jul 2020 |
DOIs | |
Publication status | Published - 1 Jun 2021 |
Externally published | Yes |
Keywords
- Aluminium dross
- Building ceiling
- Building composite
- Compressive strength
- Mould process
- Thermal conductivity