Effect of sputtering target power on microstructure and mechanical properties of nanocomposite nc-TiN/a-SiNx thin films

Sam Zhang; Deen Sun; Yong Qing Fu; Hejun Du

doi:10.1016/S0040-6090(03)01125-8

Effect of sputtering target power on microstructure and mechanical properties of nanocomposite nc-TiN/a-SiNx thin films

Sam Zhang, Deen Sun, Yong Qing Fu, Hejun Du

Research output: Contribution to journal › Article › peer-review

158 Citations (Scopus)

Abstract

Nanocrystalline TiN has been imbedded in amorphous silicon nitride matrix to form a super hard nanocomposite thin film (nc-TiN/a-SiNx) via magnetron sputtering. Adjusting Ti and Si3N4 target power ratio altered film composition, size, amount and distribution of the nc-TiN phase. At a Ti target power density of 5.5 W cm−2, the Ti to Si3N4 target power ratio should be greater than unity in order for nc-TiN to form, otherwise, Ti will dissolve in amorphous SiNx. The relationship between the film hardness and the crystallite size show Hall–Petch and anti-Hall–Petch relationship. A ‘scratch crack propagation resistance’ parameter, or CPRs=Lc1(Lc2−Lc1), has been proposed to approximate thin film toughness from the critical load data easily obtained from a scratch adhesion test.

Original language	English
Pages (from-to)	462-467
Journal	Thin Solid Films
Volume	447-8
DOIs	https://doi.org/10.1016/S0040-6090(03)01125-8
Publication status	Published - 30 Jan 2004

Keywords

Nanocomposite
Ti–Si–N film
Microstructure
Hardness
Toughness

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10.1016/S0040-6090(03)01125-8

Cite this

@article{5d3565df9e074380aa492eb1680919d2,

title = "Effect of sputtering target power on microstructure and mechanical properties of nanocomposite nc-TiN/a-SiNx thin films",

abstract = "Nanocrystalline TiN has been imbedded in amorphous silicon nitride matrix to form a super hard nanocomposite thin film (nc-TiN/a-SiNx) via magnetron sputtering. Adjusting Ti and Si3N4 target power ratio altered film composition, size, amount and distribution of the nc-TiN phase. At a Ti target power density of 5.5 W cm−2, the Ti to Si3N4 target power ratio should be greater than unity in order for nc-TiN to form, otherwise, Ti will dissolve in amorphous SiNx. The relationship between the film hardness and the crystallite size show Hall–Petch and anti-Hall–Petch relationship. A {\textquoteleft}scratch crack propagation resistance{\textquoteright} parameter, or CPRs=Lc1(Lc2−Lc1), has been proposed to approximate thin film toughness from the critical load data easily obtained from a scratch adhesion test.",

keywords = "Nanocomposite, Ti–Si–N film, Microstructure, Hardness, Toughness",

author = "Sam Zhang and Deen Sun and Fu, \{Yong Qing\} and Hejun Du",

year = "2004",

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day = "30",

doi = "10.1016/S0040-6090(03)01125-8",

language = "English",

volume = "447-8",

pages = "462--467",

journal = "Thin Solid Films",

issn = "0040-6090",

publisher = "Elsevier B.V.",

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TY - JOUR

T1 - Effect of sputtering target power on microstructure and mechanical properties of nanocomposite nc-TiN/a-SiNx thin films

AU - Zhang, Sam

AU - Sun, Deen

AU - Fu, Yong Qing

AU - Du, Hejun

PY - 2004/1/30

Y1 - 2004/1/30

N2 - Nanocrystalline TiN has been imbedded in amorphous silicon nitride matrix to form a super hard nanocomposite thin film (nc-TiN/a-SiNx) via magnetron sputtering. Adjusting Ti and Si3N4 target power ratio altered film composition, size, amount and distribution of the nc-TiN phase. At a Ti target power density of 5.5 W cm−2, the Ti to Si3N4 target power ratio should be greater than unity in order for nc-TiN to form, otherwise, Ti will dissolve in amorphous SiNx. The relationship between the film hardness and the crystallite size show Hall–Petch and anti-Hall–Petch relationship. A ‘scratch crack propagation resistance’ parameter, or CPRs=Lc1(Lc2−Lc1), has been proposed to approximate thin film toughness from the critical load data easily obtained from a scratch adhesion test.

AB - Nanocrystalline TiN has been imbedded in amorphous silicon nitride matrix to form a super hard nanocomposite thin film (nc-TiN/a-SiNx) via magnetron sputtering. Adjusting Ti and Si3N4 target power ratio altered film composition, size, amount and distribution of the nc-TiN phase. At a Ti target power density of 5.5 W cm−2, the Ti to Si3N4 target power ratio should be greater than unity in order for nc-TiN to form, otherwise, Ti will dissolve in amorphous SiNx. The relationship between the film hardness and the crystallite size show Hall–Petch and anti-Hall–Petch relationship. A ‘scratch crack propagation resistance’ parameter, or CPRs=Lc1(Lc2−Lc1), has been proposed to approximate thin film toughness from the critical load data easily obtained from a scratch adhesion test.

KW - Nanocomposite

KW - Ti–Si–N film

KW - Microstructure

KW - Hardness

KW - Toughness

UR - https://www.scopus.com/pages/publications/1342323675

U2 - 10.1016/S0040-6090(03)01125-8

DO - 10.1016/S0040-6090(03)01125-8

M3 - Article

SN - 0040-6090

VL - 447-8

SP - 462

EP - 467

JO - Thin Solid Films

JF - Thin Solid Films

ER -

Effect of sputtering target power on microstructure and mechanical properties of nanocomposite nc-TiN/a-SiNx thin films

Abstract

Keywords

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