Abstract
A transition of filmsurface morphology between wrinkling and surface relief during heating/cooling is reported for a sputtered TiNiCu thin filmshape memoryalloy. The mechanisms for this transition are discussed based on film stress evolution. During annealingsurface wrinkling occurs to relieve compressive stress in the film, while the surface relief morphology occurs during cooling due to the martensitic transformation, which relieves tensile stress.
Original language | English |
---|---|
Pages (from-to) | 171922 |
Journal | Applied Physics Letters |
Volume | 89 |
Issue number | 17 |
DOIs | |
Publication status | Published - 2006 |