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Evolution of surface morphology in TiNiCu shape memory thin films

Yong Qing Fu, Sohrab Sanjabi, Zoe Barber, Bill Clyne, Wei Min Huang, M. Cai, Jikui Luo, Andrew Flewitt, William Milne

    Research output: Contribution to journalArticlepeer-review

    29 Citations (Scopus)

    Abstract

    A transition of filmsurface morphology between wrinkling and surface relief during heating/cooling is reported for a sputtered TiNiCu thin filmshape memoryalloy. The mechanisms for this transition are discussed based on film stress evolution. During annealingsurface wrinkling occurs to relieve compressive stress in the film, while the surface relief morphology occurs during cooling due to the martensitic transformation, which relieves tensile stress.
    Original languageEnglish
    Pages (from-to)171922
    JournalApplied Physics Letters
    Volume89
    Issue number17
    DOIs
    Publication statusPublished - 2006

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