Experimental investigation of n-eicosane based circular pin-fin heat sinks for passive cooling of electronic devices

Engineering

• Phase Change Material 66%
• Thermal Conductivity 16%
• Electronic Devices 16%
• Enhancement 11%
• Material Volume 11%
• Electronics 11%
• Fin Thickness 11%
• Temperature 5%
• Experimental Investigation 5%
• Illustrates 5%
• Thermal Capacity 5%
• Volumetrics 5%
• Modules 5%
• Thermal Performance 5%
• Heat Flux 5%
• Thermal Energy 5%
• Latent Heat 5%
• Power Density 5%
• Set Point Temperature 5%
• Conductance 5%
• Portable Electronics 5%

Physics

• Heat Sink 100%
• Thermal Conductivity 16%
• Cooling 16%
• Fractions 11%
• Act 5%
• Temperature 5%
• Light 5%
• Ratios 5%
• Aluminium 5%
• Latent Heat 5%

Material Science

• Phase Change Material 33%
• Volume Fraction 5%