Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter

Adeel Arshad; Hafiz Muhammad Ali; Shahab Khushnood; Mark Jabbal

doi:10.1016/j.ijheatmasstransfer.2017.10.008

Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter

Adeel Arshad, Hafiz Muhammad Ali^*, Shahab Khushnood, Mark Jabbal

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

196 Citations (Scopus)

Abstract

This experimental study presents the parametric analysis for the round pin-finned heat sinks subjected to steady heat densities for effective and reliable cooling of mobile electronic devices. Phase change material (PCM) namely paraffin wax is adopted as energy storage material and aluminum made round pin-fins are selected as thermal conductivity enhancers (TCEs). A constant volume fraction of 9% of round pin-fins is selected with pin diameter of 2mm,3mm and 4mm and input heat flux was provided from 1.6kW/m² to 3.2kW/m² with an increment of 0.4kW/m². Three volume fractions of ψ=0.0,ψ=0.5 and ψ=1.0 of PCM amount are poured in each configuration of pin-finned heat sinks. A heat sink with no fin is chosen as a reference heat sink to quantify the effect of PCM and TCEs. The thermal performance of PCM filled heat sinks are analyzed to explore the effect of volumetric fractions of PCM, heat densities, pin diameter on latent heat phase, enhancement in operation time, heat capacity and thermal conductance. Three reference set point temperatures (SPTs) are chosen and results have evidenced that a 3mm pin diameter heat sink has best thermal performance.

Original language	English
Pages (from-to)	861-872
Number of pages	12
Journal	International Journal of Heat and Mass Transfer
Volume	117
Early online date	21 Oct 2017
DOIs	https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.008
Publication status	Published - 1 Feb 2018
Externally published	Yes

Keywords

Enhancement ratio
Heat capacity
Heat Sink
Paraffin wax
Phase change material
Round pin-fin
Set point temperatures
Thermal conductance
Thermal conductivity enhancers

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10.1016/j.ijheatmasstransfer.2017.10.008

https://nottingham-repository.worktribe.com/output/888681Licence: CC BY-NC-ND

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title = "Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter",

abstract = "This experimental study presents the parametric analysis for the round pin-finned heat sinks subjected to steady heat densities for effective and reliable cooling of mobile electronic devices. Phase change material (PCM) namely paraffin wax is adopted as energy storage material and aluminum made round pin-fins are selected as thermal conductivity enhancers (TCEs). A constant volume fraction of 9% of round pin-fins is selected with pin diameter of 2mm,3mm and 4mm and input heat flux was provided from 1.6kW/m2 to 3.2kW/m2 with an increment of 0.4kW/m2. Three volume fractions of ψ=0.0,ψ=0.5 and ψ=1.0 of PCM amount are poured in each configuration of pin-finned heat sinks. A heat sink with no fin is chosen as a reference heat sink to quantify the effect of PCM and TCEs. The thermal performance of PCM filled heat sinks are analyzed to explore the effect of volumetric fractions of PCM, heat densities, pin diameter on latent heat phase, enhancement in operation time, heat capacity and thermal conductance. Three reference set point temperatures (SPTs) are chosen and results have evidenced that a 3mm pin diameter heat sink has best thermal performance.",

keywords = "Enhancement ratio, Heat capacity, Heat Sink, Paraffin wax, Phase change material, Round pin-fin, Set point temperatures, Thermal conductance, Thermal conductivity enhancers",

author = "Adeel Arshad and Ali, {Hafiz Muhammad} and Shahab Khushnood and Mark Jabbal",

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AU - Arshad, Adeel

AU - Ali, Hafiz Muhammad

AU - Khushnood, Shahab

AU - Jabbal, Mark

PY - 2018/2/1

Y1 - 2018/2/1

N2 - This experimental study presents the parametric analysis for the round pin-finned heat sinks subjected to steady heat densities for effective and reliable cooling of mobile electronic devices. Phase change material (PCM) namely paraffin wax is adopted as energy storage material and aluminum made round pin-fins are selected as thermal conductivity enhancers (TCEs). A constant volume fraction of 9% of round pin-fins is selected with pin diameter of 2mm,3mm and 4mm and input heat flux was provided from 1.6kW/m2 to 3.2kW/m2 with an increment of 0.4kW/m2. Three volume fractions of ψ=0.0,ψ=0.5 and ψ=1.0 of PCM amount are poured in each configuration of pin-finned heat sinks. A heat sink with no fin is chosen as a reference heat sink to quantify the effect of PCM and TCEs. The thermal performance of PCM filled heat sinks are analyzed to explore the effect of volumetric fractions of PCM, heat densities, pin diameter on latent heat phase, enhancement in operation time, heat capacity and thermal conductance. Three reference set point temperatures (SPTs) are chosen and results have evidenced that a 3mm pin diameter heat sink has best thermal performance.

AB - This experimental study presents the parametric analysis for the round pin-finned heat sinks subjected to steady heat densities for effective and reliable cooling of mobile electronic devices. Phase change material (PCM) namely paraffin wax is adopted as energy storage material and aluminum made round pin-fins are selected as thermal conductivity enhancers (TCEs). A constant volume fraction of 9% of round pin-fins is selected with pin diameter of 2mm,3mm and 4mm and input heat flux was provided from 1.6kW/m2 to 3.2kW/m2 with an increment of 0.4kW/m2. Three volume fractions of ψ=0.0,ψ=0.5 and ψ=1.0 of PCM amount are poured in each configuration of pin-finned heat sinks. A heat sink with no fin is chosen as a reference heat sink to quantify the effect of PCM and TCEs. The thermal performance of PCM filled heat sinks are analyzed to explore the effect of volumetric fractions of PCM, heat densities, pin diameter on latent heat phase, enhancement in operation time, heat capacity and thermal conductance. Three reference set point temperatures (SPTs) are chosen and results have evidenced that a 3mm pin diameter heat sink has best thermal performance.

KW - Enhancement ratio

KW - Heat capacity

KW - Heat Sink

KW - Paraffin wax

KW - Phase change material

KW - Round pin-fin

KW - Set point temperatures

KW - Thermal conductance

KW - Thermal conductivity enhancers

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JO - International Journal of Heat and Mass Transfer

JF - International Journal of Heat and Mass Transfer

ER -

Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter

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