Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam

Qiang Wu, Norbert Lorenz, Kevin Cannon, Changhai Wang, A. Moore, Duncan Hand

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

2 Citations (Scopus)

Abstract

In this paper we investigate and compare a laser-driven joining process with two different illumination conditions: (i) high speed scanning of a focused beam and (ii) reasonably uniform ldquoflood illuminationrdquo of the whole sample. It is shown that the scanning beam not only avoids illuminating the central part of the device, but also provides more uniform heating of the area to be bonded than laser ldquoflood illuminationrdquo. We demonstrate bonding of three different packages: (i) LCC (Leadless chip carrier) packages, (ii) AlN and (iii) LTCC (Low temperature co-fired ceramic) substrates to ldquotop-hatrdquo packages, using a scanned beam from a fibre-delivered high power laser diode array to cure an intermediate layer of glass frit. Standard leak testing demonstrates that all those samples have excellent hermetic sealing with leak rates at the level of 10-9 atmldrcc/s.
Original languageEnglish
Title of host publication2008 2nd Electronics Systemintegration Technology Conference
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages669-678
ISBN (Print)9781424428137
DOIs
Publication statusPublished - 2008
Event2nd Electronics System-Integration Technology Conference (ESTC 2008) - Greenwich
Duration: 1 Jan 2008 → …

Conference

Conference2nd Electronics System-Integration Technology Conference (ESTC 2008)
Period1/01/08 → …

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