Improving diamond–metal adhesion with graded TiCN interlayers

Chang Qing Sun, Yong Qing Fu, Bibo Yan, Jang-Hsing Hsieh, S. P. Lau, Xiaowei Sun, Beng Kang Tay

Research output: Contribution to journalArticlepeer-review

22 Citations (Scopus)

Abstract

An approach improving diamond–metal adhesion has been developed based on modeling predictions and experimental verifications on the interfacial stresses modified by catalytic reaction. It is found that N-plasma irradiating onto Ti and tungsten-carbide substrates generates tensile surface stresses while C-plasma irradiation creates strongly compressive stress at the surfaces, both of which deteriorate the diamond–metal adhesion. It is also found that surface oxidation prevents diamondnucleation. Therefore, we applied a graded TiCN interlayer with carefully adjusting the ratio of C and N in the gas mixture to neutralize the interfacial stress and, hence, we have improved the diamond–metal adhesion substantially.
Original languageEnglish
Pages (from-to)2051
JournalJournal of Applied Physics
Volume91
Issue number4
DOIs
Publication statusPublished - 2002

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