Improving diamond–metal adhesion with graded TiCN interlayers

Chang Qing Sun, Yong Qing Fu, Bibo Yan, Jang-Hsing Hsieh, S. P. Lau, Xiaowei Sun, Beng Kang Tay

    Research output: Contribution to journalArticlepeer-review

    24 Citations (Scopus)

    Abstract

    An approach improving diamond–metal adhesion has been developed based on modeling predictions and experimental verifications on the interfacial stresses modified by catalytic reaction. It is found that N-plasma irradiating onto Ti and tungsten-carbide substrates generates tensile surface stresses while C-plasma irradiation creates strongly compressive stress at the surfaces, both of which deteriorate the diamond–metal adhesion. It is also found that surface oxidation prevents diamondnucleation. Therefore, we applied a graded TiCN interlayer with carefully adjusting the ratio of C and N in the gas mixture to neutralize the interfacial stress and, hence, we have improved the diamond–metal adhesion substantially.
    Original languageEnglish
    Pages (from-to)2051
    JournalJournal of Applied Physics
    Volume91
    Issue number4
    DOIs
    Publication statusPublished - 2002

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