Integrated condition monitoring for vehicle-ready power modules

Bing Ji, Xueguan Song, Haimeng Wu, Volker Pickert, Wenping Cao

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Citations (Scopus)

Abstract

The IGBT solder fatigue is a frequently reported failure mechanism attributed to package wear-out. It can aggravate other type of failures and degradations of the device and lead to ultimate failures. Thermal impedance can be used as a degradation indicator to detect this type of failure mode and issue early warnings for the aged IGBT In this research, different power dissipation conditions and ambient temperatures are discussed. Their impacts on the thermal impedance has been studied with FEA simulation and validated by the experimental results. This reveals the interplay between thermal impedance and these conditions. Furthermore, the health conditions of DCB substrate solders of the IGBT modules are altered by the aging test. The changes of junction temperature and thermal impedance are compared for solder layer in both health and fatigue conditions. This confirms the validity of the proposed condition monitoring method for vehicle-ready IGBT power modules.

Original languageEnglish
Title of host publicationIEEE Transportation Electrification Conference and Expo, ITEC Asia-Pacific 2014 - Conference Proceedings
EditorsFang Wang, Shiqiang Liu, Chengwei Xiao, Xiangfeng Meng
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479942398
DOIs
Publication statusPublished - 30 Oct 2014
Externally publishedYes
Event2014 IEEE Transportation Electrification Conference and Expo, ITEC Asia-Pacific 2014 - Beijing, China
Duration: 31 Aug 20143 Sep 2014

Publication series

NameIEEE Transportation Electrification Conference and Expo, ITEC Asia-Pacific 2014 - Conference Proceedings

Conference

Conference2014 IEEE Transportation Electrification Conference and Expo, ITEC Asia-Pacific 2014
Country/TerritoryChina
CityBeijing
Period31/08/143/09/14

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