Localised laser joining of glass to silicon with BCB intermediate layer

Qiang Wu, S. Kloss, Norbert Lorenz, A. Moore, Duncan Hand

Research output: Contribution to conferencePaperpeer-review

4 Citations (Scopus)

Abstract

Localised laser heating is an ideal solution to the problem of packaging micro-electro-mechanical-systems (MEMS) whilst maintaining a low device temperature to avoid changes in temperature-sensitive materials. In this paper we present localised laser bonding of glass to silicon by using a fibre-delivered high power laser diode array to cure an intermediate layer of the thermosetting polymer Benzocyclobutene (BCB). In our experiments, we use two ways to realize localised heating: one is by using scanning focused laser beam; the other is to use an axicon lens and followed a conventional lens to generate a focused ring. FE simulation indicates that provided sufficient heat sinking is provided at the rear of the device, both techniques result in very little in-process heating in the centre of the package, and this is confirmed by the use of a temperature-sensitive paint.
Original languageEnglish
Publication statusPublished - 2008
Event3rd Pacific International Conference on Application of Lasers and Optics (PICALO 2008) - Beijing
Duration: 1 Jan 2008 → …

Conference

Conference3rd Pacific International Conference on Application of Lasers and Optics (PICALO 2008)
Period1/01/08 → …

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