TY - JOUR
T1 - Microstructure and mechanical properties of sputtered Aluminum thin films
AU - Mwema, F. M.
AU - Akinlabi, E. T.
AU - Oladijo, O. P.
AU - Krishna, S.
AU - Majumdar, Jyotsna Dutta
N1 - Funding Information:
The authors would like to acknowledge the University Research Committee (URC), the University of Johannesburg for sponsoring the PhD student working on this research. The help of Mr Maphane Phalaneng of Department of Physics and Astronomy at Botswana International University of Science and Technology (BIUST) in the sputtering process is highly acknowledged. Also thank the staff of Central research facility (CRF) Indian Institute of Technology, Kharagpur for facilitating the characterization of the samples.
Publisher Copyright:
© 2019 The Authors.
PY - 2019
Y1 - 2019
N2 - The microstructure, surface roughness and mechanical properties of aluminum thin films deposited by rf magnetron sputtering are presented. The films were sputtered on stainless steel substrates at varying rf powers of 150 W, 200 W, 300 W and 350 W at a deposition time of 2 hours and at a substrate temperature of 90oC. The microstructure at 200 W shows fine, well-defined and homogeneous distributed grains. The lowest surface roughness is at the power of 150 W whereas the highest is at 250 W. The highest modulus, hardness and lowest depth of penetration are obtained at 200 W. The results indicate no direct relationship among rf power, mechanical, roughness and microstructure of Al thin films deposited at substrate temperature of 90oC. As such, optimization of the sputtering process for rf power is necessary for deposition of quality Al films on metals.
AB - The microstructure, surface roughness and mechanical properties of aluminum thin films deposited by rf magnetron sputtering are presented. The films were sputtered on stainless steel substrates at varying rf powers of 150 W, 200 W, 300 W and 350 W at a deposition time of 2 hours and at a substrate temperature of 90oC. The microstructure at 200 W shows fine, well-defined and homogeneous distributed grains. The lowest surface roughness is at the power of 150 W whereas the highest is at 250 W. The highest modulus, hardness and lowest depth of penetration are obtained at 200 W. The results indicate no direct relationship among rf power, mechanical, roughness and microstructure of Al thin films deposited at substrate temperature of 90oC. As such, optimization of the sputtering process for rf power is necessary for deposition of quality Al films on metals.
KW - Aluminum
KW - Magnetron sputtering
KW - Power
KW - Surface roughness
KW - Thin films
UR - http://www.scopus.com/inward/record.url?scp=85072378480&partnerID=8YFLogxK
U2 - 10.1016/j.promfg.2019.06.038
DO - 10.1016/j.promfg.2019.06.038
M3 - Conference article
AN - SCOPUS:85072378480
SN - 2351-9789
VL - 35
SP - 929
EP - 934
JO - Procedia Manufacturing
JF - Procedia Manufacturing
T2 - 2nd International Conference on Sustainable Materials Processing and Manufacturing, SMPM 2019
Y2 - 8 March 2019 through 10 March 2019
ER -