Numerical analysis of flow and heat transfer characteristics of Y-fractal-link micro-channel networks

Guoqiang Xu, Meng Wang, Zhi Tao, Shuiting Ding, Hongwei Wu, Jun Guo

Research output: Contribution to conferencePaperpeer-review

Abstract

A new fractal cooling structure, Y-fractal-link micro channel networks, is proposed to improve the flow and heat transfer characteristics of the micro channel flow path in heat sink. A three-dimensional finite-volume method is employed to simultaneously solve the governing equations for continuity, momentum and energy conservation, and the non-conformal mesh technique is applied. In the numerical computations, a constant heat flux is used as a boundary condition of the top wall of chip and the flow is assumed to be laminar and fully developed. Compared with the straight parallel and traditional fractal-link micro channel networks, the detailed temperature and pressure distributions of the Y-fractal-link micro channel networks are presented. Furthermore, the optimization of this new structure is discussed with some important parameters, such as the number of branching levels, the bifurcation angle and the number of branches at each level. Numerical results reveal that the Y-fractal-link micro channel networks could significantly improve the integrated performance of heat sink. The pressure drop through the micro channel of this new structure decreases obviously when compared with that of conventional channels. In addition, the new networks present more uniform temperature distribution and relative lower maximum surface temperature than that of conventional networks. Results also show that the optimized structure of Y-fractal-link micro channel networks could remarkably enhance heat transfer and decrease pumping power.
Original languageEnglish
Publication statusPublished - May 2008
EventThe 8th International Symposium on Advances in Computational Heat Transfer - Marrakech
Duration: 1 May 2008 → …

Conference

ConferenceThe 8th International Symposium on Advances in Computational Heat Transfer
Period1/05/08 → …

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