Numerical study of nanocomposite phase change material-based heat sink for the passive cooling of electronic components

Engineering

• Conjugate Convective Heat Transfer 16%
• Copper (Cu) 5%
• Density 33%
• Enhancement 11%
• Heat Sink 66%
• Heat Transfer Rate 11%
• High Rate 5%
• Lower Reduction 5%
• Melting 5%
• Melting Process 5%
• Metallic Nanoparticles 5%
• Numerical Study 11%
• Performance 5%
• Reduction 11%
• Simulation 5%
• Solidification 5%
• Storage Capacity 16%
• Thermal Performance 5%
• Transients 5%
• Two Dimensional 5%

Material Science

• Electronic Component 11%
• Heat Transfer 100%
• Nanocomposites 22%
• Phase Change Material 22%
• Volume Fraction 22%

Physics

• Cooling 5%
• Heat Storage 33%
• Melting Point 33%
• Performance 5%
• Simulation 5%
• Solidification 5%
• Transients 5%