Raman and finite-element analysis of a mechanically strained silicon microstructure.

Michael Bowden, Derek Gardiner, David Wood, James Burdess, Alun Harris, John Hedley

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)


Raman microspectroscopy has been used to determine the volumetric micro-strain distribution in mechanically stressed silicon microstructures. Data are presented as strain images with a spatial resolution of around 0.8 µm. A useful correlation is demonstrated between finite-element analysis calculations of volumetric strain and Raman shift. The results demonstrate that silicon beam structures incorporating a 90° bend will experience a non-uniform stress distribution along the bend radius for small radii of curvature.
Original languageEnglish
Pages (from-to)7-12
Number of pages6
JournalJournal of micromechanics and microengineering.
Issue number1
Publication statusPublished - 1 Jan 2001


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