Raman and finite-element analysis of a mechanically strained silicon microstructure.

Michael Bowden, Derek Gardiner, David Wood, James Burdess, Alun Harris, John Hedley

    Research output: Contribution to journalArticlepeer-review

    17 Citations (Scopus)

    Abstract

    Raman microspectroscopy has been used to determine the volumetric micro-strain distribution in mechanically stressed silicon microstructures. Data are presented as strain images with a spatial resolution of around 0.8 µm. A useful correlation is demonstrated between finite-element analysis calculations of volumetric strain and Raman shift. The results demonstrate that silicon beam structures incorporating a 90° bend will experience a non-uniform stress distribution along the bend radius for small radii of curvature.
    Original languageEnglish
    Pages (from-to)7-12
    Number of pages6
    JournalJournal of micromechanics and microengineering.
    Volume11
    Issue number1
    DOIs
    Publication statusPublished - 1 Jan 2001

    Keywords

    • Crystalline silicon
    • Cubic-crystals
    • Stress
    • Spectroscopy
    • Frequencies
    • Phonons

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