Rate-dependent mechanical behavior of dual-phase structure of Sn interconnect materials

Zhanhu Guo*, Xin Zhang, Hongbo Lu, Xiaobin Luo, Yuanwei Jia, Yongxia Yu, Yingen Feng, Zaki I. Zaki, Mohamed E. Khalifa, Mohammed A. Amin, Jinzhi Peng, Y.L. Wang, Xiaojing Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

This study systematically investigates the effects of strain rate (from 1.67 × 10⁻5 to 10⁻1 s⁻1) on the tensile deformation and fracture behavior of β-Sn-based dual-phase alloys including Sn5Sb, Sn25Sb, Sn37Pb, and Sn58Bi. Both pure Sn and Sn5Sb exhibit an increased elongation with rising the strain rate, while Sn25Sb, Sn37Pb, and Sn58Bi display inversely a reduced ductility. At low strain rates, Sn37Pb and Sn58Bi demonstrate a superplastic behavior characterized by the stress index n values of 3.4 and 4.3, respectively, indicating a dominant deformation mechanism involving grain boundary migration/slip and dislocation climb. At high strain rates, their stress indices abruptly increase to 12.6 and 15.3, suggesting a transition to dislocation slip-controlled deformation. Pure Sn, Sn5Sb, and Sn37Pb maintain ductile fracture throughout the tested strain range, whereas Sn25Sb exhibits a brittle fracture under all loading rates. Notably, Sn58Bi shows a strain rate-dependent fracture mode transition: brittle fracture predominates at low strain rates but shifts to quasi-brittle fracture at elevated rates, revealing its unique strain rate-sensitive fracture mechanism.
Original languageEnglish
Article number630
Number of pages17
JournalJournal of Materials Science: Materials in Electronics
Volume36
Issue number10
DOIs
Publication statusPublished - 10 Apr 2025

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