Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application

Siyang Dai, Zhiqiang Wang*, Haimeng Wu, Xueguan Song, Guofeng Li, Volker Pickert

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

10 Citations (Scopus)
99 Downloads (Pure)

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Physics

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