Thermal management of electronics: An experimental analysis of triangular, rectangular and circular pin-fin heat sinks for various PCMs

Hafiz Muhammad Ali*, Muhammad Junaid Ashraf, Ambra Giovannelli, Muhammad Irfan, Talal Bin Irshad, Hafiz Muhammad Hamid, Faisal Hassan, Adeel Arshad

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

128 Citations (Scopus)

Abstract

This study implies experimental investigation for optimization of heat transfer in electronic integrated circuits using close packed phase change materials (PCMs) filled pin-fin heat sinks. The aim of this study is to find the most efficient pin-fin configuration filled with optimum PCM to extend the operating range of electronic circuits. The experimental methodology is based upon variation of pin-fin configurations in rectangular, round and triangular cross-sections. Each configuration is allowed a pin-fin volumetric percentage of 9%. For analysis using PCM a volume fraction of 90% is maintained and six PCMs with different thermo-physical properties (varying melting temperatures, latent heats and heat capacities) are selected. These include paraffin wax, RT-54, RT-44, RT-35HC, SP-31 and n-eicosane. Moreover, the power levels mimicking heat input range between 5 W and 8 W. The resulting information is analyzed for the performance of a heat sink with and without PCM. Besides that, PCM ascendency is manipulated in terms of operational time, enhancement ratios, Stefan number and storage ratio. The outcomes suggest that triangular pin-fins are found to be the most effective pin-fin configuration for heat transfer both with and without PCM.

Original languageEnglish
Pages (from-to)272-284
Number of pages13
JournalInternational Journal of Heat and Mass Transfer
Volume123
Early online date20 Mar 2018
DOIs
Publication statusPublished - 1 Aug 2018
Externally publishedYes

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