Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison

Hafiz Muhammad Ali; Adeel Arshad; Mark Jabbal; P. G. Verdin

doi:10.1016/j.ijheatmasstransfer.2017.10.065

Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison

Hafiz Muhammad Ali^*, Adeel Arshad, Mark Jabbal, P. G. Verdin

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

195 Citations (Scopus)

Abstract

The present paper covers the comparison of two different configurations (square and circular) pin-fin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2mm square and 3mm circular fin thickness of constant volume fraction of 9% are chosen and input heat fluxes from 1.2kW/m² to 3.2kW/m² with an increment of 0.4kW/m² are provided. Two different critical set point temperatures (SPTs) 45°C and 65°C are chosen to explore the thermal performance in terms of enhancement ratios, enhancement in operation time, latent heating phase duration, thermal capacity and conductance. The results show that 3mm diameter of circular pin-fins has the best thermal performance in passive thermal management of electronic devices.

Original language	English
Pages (from-to)	1199-1204
Number of pages	6
Journal	International Journal of Heat and Mass Transfer
Volume	117
Early online date	5 Nov 2017
DOIs	https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.065
Publication status	Published - Feb 2018
Externally published	Yes

Keywords

n-Eicosane
Paraffin wax
Phase change materials (PCMs)
Pin-fin heat sinks
Set point temperatures (SPTs)
Thermal conductivity enhancers (TCEs)

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10.1016/j.ijheatmasstransfer.2017.10.065

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title = "Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison",

abstract = "The present paper covers the comparison of two different configurations (square and circular) pin-fin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2mm square and 3mm circular fin thickness of constant volume fraction of 9% are chosen and input heat fluxes from 1.2kW/m2 to 3.2kW/m2 with an increment of 0.4kW/m2 are provided. Two different critical set point temperatures (SPTs) 45°C and 65°C are chosen to explore the thermal performance in terms of enhancement ratios, enhancement in operation time, latent heating phase duration, thermal capacity and conductance. The results show that 3mm diameter of circular pin-fins has the best thermal performance in passive thermal management of electronic devices.",

keywords = "n-Eicosane, Paraffin wax, Phase change materials (PCMs), Pin-fin heat sinks, Set point temperatures (SPTs), Thermal conductivity enhancers (TCEs)",

author = "Ali, {Hafiz Muhammad} and Adeel Arshad and Mark Jabbal and Verdin, {P. G.}",

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T2 - A comparison

AU - Ali, Hafiz Muhammad

AU - Arshad, Adeel

AU - Jabbal, Mark

AU - Verdin, P. G.

PY - 2018/2

Y1 - 2018/2

N2 - The present paper covers the comparison of two different configurations (square and circular) pin-fin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2mm square and 3mm circular fin thickness of constant volume fraction of 9% are chosen and input heat fluxes from 1.2kW/m2 to 3.2kW/m2 with an increment of 0.4kW/m2 are provided. Two different critical set point temperatures (SPTs) 45°C and 65°C are chosen to explore the thermal performance in terms of enhancement ratios, enhancement in operation time, latent heating phase duration, thermal capacity and conductance. The results show that 3mm diameter of circular pin-fins has the best thermal performance in passive thermal management of electronic devices.

AB - The present paper covers the comparison of two different configurations (square and circular) pin-fin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2mm square and 3mm circular fin thickness of constant volume fraction of 9% are chosen and input heat fluxes from 1.2kW/m2 to 3.2kW/m2 with an increment of 0.4kW/m2 are provided. Two different critical set point temperatures (SPTs) 45°C and 65°C are chosen to explore the thermal performance in terms of enhancement ratios, enhancement in operation time, latent heating phase duration, thermal capacity and conductance. The results show that 3mm diameter of circular pin-fins has the best thermal performance in passive thermal management of electronic devices.

KW - n-Eicosane

KW - Paraffin wax

KW - Phase change materials (PCMs)

KW - Pin-fin heat sinks

KW - Set point temperatures (SPTs)

KW - Thermal conductivity enhancers (TCEs)

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EP - 1204

JO - International Journal of Heat and Mass Transfer

JF - International Journal of Heat and Mass Transfer

ER -

Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison

Abstract

Keywords

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