Thermal Performance of PCM-based Heat Sink with Partially Filled Copper Oxide Coated Metal-foam for Thermal Management of Microelectronics

Adeel Arshad, Mark Jabbal, Yuying Yan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

10 Citations (Scopus)

Abstract

In this paper, the heat transfer enhancement is experimentally investigated of a thermal management system (TMS) integrated with metal foam embedded in phase change material (PCM). The copper metal-foam is coated with a thin hard layer of high-temperature copper oxide (CuO) which is acting as a thermal conductivity enhancer (TCE). The metal- foam/PCM composite is attached to a heat sink and effect of various variables such as filling thickness ratio, volumetric fraction of PCM and number of input power levels are experimentally studied. The filling thickness ratios of metal- foam are varied from 0.0-1.0, RT-28HC as PCM of 0.0 and 1.0 volumetric fractions and heating powers are applied from 2 to 5 W. The melting and solidifying phenomenon of TMS is investigated with and without metal-foam and PCM at each input heating power. The results showed that metal- foam/PCM based heat sink can extract the base temperature during the heating period and heat transfer enhancement is improved monotonously with the increase of filling height ratio. The filling thickness ratio of 0.5 revealed the best thermal performance of PCM filled CuO coated metal-foam heat sink for passive cooling of portable electronic devices.

Original languageEnglish
Title of host publicationProceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages697-702
Number of pages6
ISBN (Electronic)9781728197647
DOIs
Publication statusPublished - 21 Jul 2020
Externally publishedYes
Event19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020 - Virtual, Orlando, United States
Duration: 21 Jul 202023 Jul 2020

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2020-July
ISSN (Print)1936-3958

Conference

Conference19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
Country/TerritoryUnited States
CityVirtual, Orlando
Period21/07/2023/07/20

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