@inproceedings{c2272f89759c46e7a077c2d1c860a64e,
title = "Thermal Performance of PCM-based Heat Sink with Partially Filled Copper Oxide Coated Metal-foam for Thermal Management of Microelectronics",
abstract = "In this paper, the heat transfer enhancement is experimentally investigated of a thermal management system (TMS) integrated with metal foam embedded in phase change material (PCM). The copper metal-foam is coated with a thin hard layer of high-temperature copper oxide (CuO) which is acting as a thermal conductivity enhancer (TCE). The metal- foam/PCM composite is attached to a heat sink and effect of various variables such as filling thickness ratio, volumetric fraction of PCM and number of input power levels are experimentally studied. The filling thickness ratios of metal- foam are varied from 0.0-1.0, RT-28HC as PCM of 0.0 and 1.0 volumetric fractions and heating powers are applied from 2 to 5 W. The melting and solidifying phenomenon of TMS is investigated with and without metal-foam and PCM at each input heating power. The results showed that metal- foam/PCM based heat sink can extract the base temperature during the heating period and heat transfer enhancement is improved monotonously with the increase of filling height ratio. The filling thickness ratio of 0.5 revealed the best thermal performance of PCM filled CuO coated metal-foam heat sink for passive cooling of portable electronic devices. ",
keywords = "Copper oxide, Heat sink, Metal- foam, Phase change material, Thermal management",
author = "Adeel Arshad and Mark Jabbal and Yuying Yan",
note = "Funding Information: This research is facilitated by the Faculty of Engineering, University of Nottingham, UK research infrastructure. The corresponding author (Adeel Arshad) acknowledges the University of Nottingham for awarding him the Faculty of Engineering Research Excellence PhD Scholarship to pursue a Ph.D. research program.; 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020 ; Conference date: 21-07-2020 Through 23-07-2020",
year = "2020",
month = jul,
day = "21",
doi = "10.1109/ITherm45881.2020.9190574",
language = "English",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
publisher = "IEEE",
pages = "697--702",
booktitle = "Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020",
address = "United States",
}