Thermal process enhancement of HNCPCM filled heat sink: Effect of hybrid nanoparticles ratio and shape

Adeel Arshad*, Mark Jabbal, Hamza Faraji, Muhammad Anser Bashir, Pouyan Talebizadehsardari, Yuying Yan

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)

Abstract

The present study based on the numerical investigation of a hybrid nanocomposite phase change material (HNCPCM) filled heat sink for passive cooling of electronic devices. The combination of graphene oxide (GO) and silver (Ag) hybrid nanoparticles are added inside the RT-28HC to enhance thermal performance. The volume fraction ratios of Ag:GO are varied from 0:0, 0:4, 1:3, 2:2, 3:1 and 4:0. Four different shape factor values of 3.7, 4.9, 5.7 and 16.1 of Ag-GO are varied. The transient simulations are carried out to solve the governing equations using the finite volume method scheme. The results depicted that employing HNCPCM has better heat transfer enhancement compared to the pure PCM because of the addition of nanoparticles. The results showed that adding the Ag-GO inside the RT-28HC improved the thermal conductivity and uniformity in the melting process compared to the RT-28HC based heat sink. With the addition of Ag-GO, melting time of HNCPCM filled heat sink is reduced and heat transfer rate in increased. The optimum ratio of 1:3 of Ag:GO nanoparticles and shape factor value of 16.1 show the higher thermal conductivity of 0.348 W/m.K, 12.93% reduction in melting time, 8.65% enhancement in heat storage capacity and rate of heat transfer.

Original languageEnglish
Article number105323
Number of pages17
JournalInternational Communications in Heat and Mass Transfer
Volume125
Early online date19 May 2021
DOIs
Publication statusPublished - 1 Jun 2021
Externally publishedYes

Keywords

  • Electronics cooling
  • Graphene oxide (GO)
  • Heat sink
  • Hybrid nanocomposite phase change material
  • Silver (Ag)

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