Three-Dimensional Simulation Platform for Optimal Designs of the MEMS Microphone

Jianbing Cai, Jian Zhou*, Zhangbin Ji, Kaitao Tan, Yi Liu, Yongqing Fu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

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Abstract

MEMS microphone has a wide range of application prospects in electronic devices such as mobile phones, headphones, and hearing aids due to its small size, low cost, and reliable performance. Research and development of MEMS microphones involves multiple thermo-electro-mechanical couplings among various physical and electrical fields. Unfortunately, there is not an accurate three-dimensional (3D) MEMS microphone simulation platform, which can be applied for the design of chip parameters and packaging characteristics. Herein, based on commercial COMSOL software, we have established a 3D simulation platform for MEMS microphones, which is used to systematically study the influences of geometric structure and physics parameters on the sensitivity and frequency responses of the microphone and consider the influences of packaging characteristics on the performance of the microphone. The simulation results are consistent with those obtained using a lumped element method, which proves the accuracy of the simulation platform. The platform can be used to design and explore new principles or mechanisms of MEMS microphone devices.
Original languageEnglish
Article number959480
Number of pages8
JournalFrontiers in Materials
Volume9
DOIs
Publication statusPublished - 22 Jul 2022

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