Three-Dimensional Simulation Platform for Optimal Designs of the MEMS Microphone

Jianbing Cai; Jian Zhou; Zhangbin Ji; Kaitao Tan; Yi Liu; Yongqing Fu

doi:10.3389/fmats.2022.959480

Three-Dimensional Simulation Platform for Optimal Designs of the MEMS Microphone

Jianbing Cai, Jian Zhou^*, Zhangbin Ji, Kaitao Tan, Yi Liu, Yongqing Fu

^*Corresponding author for this work

Mathematics, Physics and Electrical Engineering

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

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Abstract

MEMS microphone has a wide range of application prospects in electronic devices such as mobile phones, headphones, and hearing aids due to its small size, low cost, and reliable performance. Research and development of MEMS microphones involves multiple thermo-electro-mechanical couplings among various physical and electrical fields. Unfortunately, there is not an accurate three-dimensional (3D) MEMS microphone simulation platform, which can be applied for the design of chip parameters and packaging characteristics. Herein, based on commercial COMSOL software, we have established a 3D simulation platform for MEMS microphones, which is used to systematically study the influences of geometric structure and physics parameters on the sensitivity and frequency responses of the microphone and consider the influences of packaging characteristics on the performance of the microphone. The simulation results are consistent with those obtained using a lumped element method, which proves the accuracy of the simulation platform. The platform can be used to design and explore new principles or mechanisms of MEMS microphone devices.

Original language	English
Article number	959480
Number of pages	8
Journal	Frontiers in Materials
Volume	9
DOIs	https://doi.org/10.3389/fmats.2022.959480
Publication status	Published - 22 Jul 2022

Keywords

Materials
MEMS
microphone
3D simulation
frequency responses
sensitivity

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@article{07381f725f8e4b4792d5fa66a9eda377,

title = "Three-Dimensional Simulation Platform for Optimal Designs of the MEMS Microphone",

abstract = "MEMS microphone has a wide range of application prospects in electronic devices such as mobile phones, headphones, and hearing aids due to its small size, low cost, and reliable performance. Research and development of MEMS microphones involves multiple thermo-electro-mechanical couplings among various physical and electrical fields. Unfortunately, there is not an accurate three-dimensional (3D) MEMS microphone simulation platform, which can be applied for the design of chip parameters and packaging characteristics. Herein, based on commercial COMSOL software, we have established a 3D simulation platform for MEMS microphones, which is used to systematically study the influences of geometric structure and physics parameters on the sensitivity and frequency responses of the microphone and consider the influences of packaging characteristics on the performance of the microphone. The simulation results are consistent with those obtained using a lumped element method, which proves the accuracy of the simulation platform. The platform can be used to design and explore new principles or mechanisms of MEMS microphone devices.",

keywords = "Materials, MEMS, microphone, 3D simulation, frequency responses, sensitivity",

author = "Jianbing Cai and Jian Zhou and Zhangbin Ji and Kaitao Tan and Yi Liu and Yongqing Fu",

note = "Funding information: This work was supported by the NSFC (No.52075162), The Innovation Leading Program of New and High-tech Industry of Hunan Province (2020GK2015 and 2021GK4014), The Joint Fund Project of the Ministry of Education, The Excellent Youth Fund of Hunan Province (2021JJ20018), the Huxiang Youth Talent Project (2019RS2062), the Key Research & Development Program of Guangdong Province (2020B0101040002), the Natural Science Foundation of Changsha (kq2007026), the Engineering Physics and Science Research Council of the United Kingdom (EPSRC EP/P018998/1), and International Exchange Grant (IEC/NSFC/201078) through Royal Society and the NSFC.",

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doi = "10.3389/fmats.2022.959480",

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TY - JOUR

T1 - Three-Dimensional Simulation Platform for Optimal Designs of the MEMS Microphone

AU - Cai, Jianbing

AU - Zhou, Jian

AU - Ji, Zhangbin

AU - Tan, Kaitao

AU - Liu, Yi

AU - Fu, Yongqing

N1 - Funding information: This work was supported by the NSFC (No.52075162), The Innovation Leading Program of New and High-tech Industry of Hunan Province (2020GK2015 and 2021GK4014), The Joint Fund Project of the Ministry of Education, The Excellent Youth Fund of Hunan Province (2021JJ20018), the Huxiang Youth Talent Project (2019RS2062), the Key Research & Development Program of Guangdong Province (2020B0101040002), the Natural Science Foundation of Changsha (kq2007026), the Engineering Physics and Science Research Council of the United Kingdom (EPSRC EP/P018998/1), and International Exchange Grant (IEC/NSFC/201078) through Royal Society and the NSFC.

PY - 2022/7/22

Y1 - 2022/7/22

N2 - MEMS microphone has a wide range of application prospects in electronic devices such as mobile phones, headphones, and hearing aids due to its small size, low cost, and reliable performance. Research and development of MEMS microphones involves multiple thermo-electro-mechanical couplings among various physical and electrical fields. Unfortunately, there is not an accurate three-dimensional (3D) MEMS microphone simulation platform, which can be applied for the design of chip parameters and packaging characteristics. Herein, based on commercial COMSOL software, we have established a 3D simulation platform for MEMS microphones, which is used to systematically study the influences of geometric structure and physics parameters on the sensitivity and frequency responses of the microphone and consider the influences of packaging characteristics on the performance of the microphone. The simulation results are consistent with those obtained using a lumped element method, which proves the accuracy of the simulation platform. The platform can be used to design and explore new principles or mechanisms of MEMS microphone devices.

AB - MEMS microphone has a wide range of application prospects in electronic devices such as mobile phones, headphones, and hearing aids due to its small size, low cost, and reliable performance. Research and development of MEMS microphones involves multiple thermo-electro-mechanical couplings among various physical and electrical fields. Unfortunately, there is not an accurate three-dimensional (3D) MEMS microphone simulation platform, which can be applied for the design of chip parameters and packaging characteristics. Herein, based on commercial COMSOL software, we have established a 3D simulation platform for MEMS microphones, which is used to systematically study the influences of geometric structure and physics parameters on the sensitivity and frequency responses of the microphone and consider the influences of packaging characteristics on the performance of the microphone. The simulation results are consistent with those obtained using a lumped element method, which proves the accuracy of the simulation platform. The platform can be used to design and explore new principles or mechanisms of MEMS microphone devices.

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KW - MEMS

KW - microphone

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KW - frequency responses

KW - sensitivity

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DO - 10.3389/fmats.2022.959480

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VL - 9

JO - Frontiers in Materials

JF - Frontiers in Materials

M1 - 959480

ER -

Three-Dimensional Simulation Platform for Optimal Designs of the MEMS Microphone

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