Towards the thermal management of electronic devices: A parametric investigation of finned heat sink filled with PCM

Engineering

• Heat Sink 100%
• Heat Transfer Enhancement for Application 12%
• Reduction 8%
• Temperature 8%
• Electronic Devices 8%
• Lower Temperature 4%
• Computer Simulation 4%
• Thermal Conductivity 4%
• Temperature Distribution 4%
• Two Dimensional 4%
• Input Power 4%
• Transients 4%
• Thermal Performance 4%
• Flow Field 4%
• Latent Heat 4%
• Temperature Field 4%
• Finite Volume Method 4%
• Dimensional Analysis 4%
• Set Point Temperature 4%
• Melting 4%

Physics

• Melting Point 12%
• Temperature 8%
• Temperature Distribution 8%
• Heat 8%
• Variations 4%
• Thermal Conductivity 4%
• Fractions 4%
• Transients 4%
• Flow Distribution 4%
• Phase Change 4%
• Dimensional Analysis 4%
• Latent Heat 4%

Material Science

• Phase Change Material 33%
• Volume Fraction 20%
• Electronic Component 8%